Teledyne DALSA is part of the Teledyne Imaging group and a world leader in the design, manufacture and deployment of digital imaging components for the machine vision market. Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are used in thousands of automated inspection systems around the world and across multiple industries including semiconductor, solar cell, flat panel display, electronics, automotive, medical, packaging and general manufacturing.

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms a collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions.

Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

Unprecedented Speed and High Resolution

The new Genie Nano-CXP series is Teledyne’s CoaXPress line of CMOS area scan cameras that redefine performance and feature the latest On-Semiconductor and E2V sensors. These newest industry leading image CMOS sensors range from 16 to 67-megapixel resolution with added and proven CoaXPress 6.25 Gbps technology offering breakthrough speed, robust build quality for wide operating temperature, and an unmatched feature set at an incredible price.

Perfectly complemented by the half-length Xtium-CXP frame grabber, they have been designed to work synergistically, minimizing CPU usage and improving processing times for host applications by enabling maximum sustained throughput and ready-to-use image data.

Offering 25 million pixels at 80 fps in a small form factor, these new Genie Nano-CXP cameras are engineered to deliver high-speed, dependable results for applications such as semiconductor wafer inspection, electronics manufacturing, solar panel inspection, and machine vision.

Key Features

    • First four models with 16 and 25M offered in both monochrome and NIR enhanced versions
    • Industry’s smallest 25M CXP cameras
    • Trigger-to-Image Reliability (T2IR) framework improves the reliability of your inspection system and protects from data loss
    • GenICam, GenCP compliant
    • Robust all-metal body with 3-year warranty

Targeting Error Proofing, Identification And Robotic Guidance Applications

Teledyne DALSA new low-cost BOA™ Spot XL vision sensors are available for industrial automation and inspection. Designed for error proofing, identification, general inspection and robot guidance, BOA Spot XL vision sensors deliver the performance and capabilities to rival any product in its class.

The all-in-one BOA Spot XL comes with integrated LED lighting, lens cover and easy-to-use application software, providing high value capabilities at a low cost of ownership. Robust embedded vision tools include positioning, part locating, pattern matching, measuring, feature or defect detection and identifying, including automatic reading of characters (OCR) based on a pre-trained AI (Artificial Intelligence) inference network. Additional features include extensive image preprocessors and advanced calibration for image correction and system coordinate mapping.

“BOA Spot XL vision sensors deliver the performance and capabilities of a sophisticated smart vision system,” commented Steve Geraghty, General Manager of Teledyne DALSA’s Industrial Imaging Solutions US. “This latest BOA Spot model offers manufacturers the tools and integration flexibility for a wide range of automation and inspection applications.”

Inspections using BOA Spot XL vision sensors can be triggered by parts in motion or from a PLC after being moved into a stationary position. Compatible protocols, such as Ethernet/IP and PROFINET, provide standard languages for communicating with 3rd party equipment or the factory enterprise.

Thru- and surface-mounting options and a slim form factor lend automation and system developers the benefit of positioning the BOA Spot XL in tight places.

Key Features

    • Integrated LED lighting, lens cover, easy-to-use software, and easy integration with factory systems
    • Embedded vision tools for part locating, feature finding, counting, and measuring applications
    • Quickly deploy for numerous automated inspection and identification tasks

About Teledyne DALSA

Teledyne DALSA, part of Teledyne Imaging Group, serves a vast range of industries and markets with a remarkable range of imaging products. You’ll find their products in factories, laboratories, studios, hospitals and inspection stations all over the world–and even on other planets. From industrial inspection to aerial photogrammetry, mail sorting to factory automation, security to spectroscopy, medical radiography to astronomy, their imaging innovations allow their customers unprecedented insight, enabling new discoveries and providing competitive advantage.

For more information, visit www.teledynedalsa.com.

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